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  UMB05F~umb10f features low profile space ideal for automated placement glass passivated chip junction low forward volta g e dro p gp low leakage current high forward surge capability hi g h temperature solderin g 260 /10 seconds at terminals sof2-4f component in accordance to rohs 2002/95/1 and weee 2002/96/ec major ratings and characteristics mechanical date case: sof2-4 molded plastic over glass passivated chip terminals: solder plated, solderable per j-std-002b and jesd22-b102d polarity: polarity symbols marked on body i r 5.0 a v f 1.1 v t j max 150 c i f(av) 0.5 a, 0.8 a v rrm 50v to 1000v i fsm 20 a polarity: polarity symbols marked on body maximum ratings & thermal characteristics (t a = 25 c unless otherwise noted) v c v maximum rms voltage v rms 35 70 140 280 420 560 700 umb 6f umb 8f umb 10f unit maximum repetitive peak reverse voltage v rrm 50 100 200 400 items symbol umb 05f umb 1f umb 2f umb 4f 600 800 1000 v t j max . 150 c peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (jedec method) i fsm 20 a maximum average forward rectified current i f(av) 0.5 0.8 at t a =30 -on glass-epoxy p.c.b (1) a -on aluminum substrate (2) maximum d c blocking voltage v dc 50 100 200 400 600 800 1000 v note 1: on glass epoxy p.c.b. mounted on 0.060.04 (1.51.1mm) pads operating junction and storage temperature range t j , t stg ?55 to +150 thermal resistance from junction to ambient per leg r ja (1) 100 /w r ja (2) 80 thermal resistance from junction to lead per leg (1) r jl 30 /w note 2: on aluminum substrate p.c.b. with an area of 0.8 0.8 (2020mm) mounted on 0.060.04 (1.51.1mm) solder pad electrical characteristics (t a = 25 c unless otherwise noted) note 3: pulse test:300 s pulse width,1% duty cycle. 5 100 a reverse current per leg v r =v dc t j =25 t j =125 i r -- unit instantaneous forward voltage per leg i f =0.4a (3) v f - 0.96 1.10 v items test conditions symbol min type max surface mount bridge rectifiers
characteristic curves (t a =25 unless otherwise noted) 1 a ) fig.1 forward current derating curve 20 fig.2 maximum non-repetitive peak forward surge current 0.2 0.4 0.6 0.8 a verage forward current ( a glass epoxy p.c.b al substrate 5 10 15 peak forward surge current(a) 8.3ms single half sine-wave fi 3 tilitt f d 0 0 25 50 75 100 125 150 a amibant temperature( ) 0 1 10 100 number of cycles at 60hz fig 4 typical reverse leakage 1 10 a neous forward c urrent(a) fi g. 3 t yp i ca l i ns t an t aneous f orwar d characteristics 1 10 s reverse leakage r rent( a) fig . 4 typical reverse leakage characteristics tj=125 tj=75 0.01 0.1 0.6 0.9 1.2 1.5 1.8 instant a c instantaneous forward voltage(v) 0.01 0.1 0% 20% 40% 60% 80% 100% instantaneou s cu r percent or rated peak reverse voltage (%) tj=25 tj=25 pulse with=300 s 1%duty cycle UMB05F~umb10f surface mount bridge rectifiers
marking annotation of marking code: device type device marking UMB05F b1 umb6f b5 umb8f b6 umb10f b7 umb1f b2 umb2f b3 umb4f b4 marking meaning mdd = trademark bx = marking code x = 1,2,3 7. see the table at the right . package outline soldering pad UMB05F~umb10f surface mount bridge rectifiers sof2-4f


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